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Amphenol Canada
sales@amphenolcanada.com
(416) 291-4401

Micro-D Connectors

ENGINEERED SOLUTIONS DESIGNED TO FIT

The Amphenol Micro-D connector series (M83513) offers proven military spec performance and reliability in rectangular and stripline micro connectors. The Micro-D connectors are available in rectangular D, strip and custom card edge configurations, with contacts on .050 (1.27) centers. Inserts in Micro-D miniature connectors with signal and coax/power contacts are also available.  The socket contact is a precision fabricated tube. Pin and socket contacts are epoxy retained in high-grade thermoplastic insulators. The contact system has proven reliability, exceeding the performance specifications of MIL-DTL-83513. Terminations are available in a broad range including solder cup, terminated to wire harness, vertical and right angle PCB. Plastic and metal shell versions are available in Micro-D series, in a broad range of shell finishes. A broad range of mounting hardware is available (jackscrews, posts, guide pins) as well as straight and angled back-shell.

FEATURES AND BENEFITS

  • Amphenol design not like other stamped and formed designs
  • Fully qualified per MIL-DTL-83513 requirements
  • One piece contact with equally spaced compliant tines
  • Gold over Nickel versus gold over the copper flash barrier
  • Tighter control over plating process
  • Uniform Plating thickness
  • Automated Stamping versus twist process variations
  • Integrated closed engaging end ensures uniform insertion forces
  • Low mating/unmating force
  • Preferred contact for space and satellite applications
  • Continuous connection along the length of the contact beam (line contact) versus multi-point connection (point contact)

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DOCUMENTS


MICRO-MINIATURE CONTACT SYSTEM

The Micro-miniature contact system employs a precision stamped and formed pin contact recessed within the plug insulator. The contact system has proven reliability, exceeding the performance specifications of MIL-DTL-83513.

MICRO-D STRIP CONNECTOR

One piece insulator: Polyphenylene sulfide (Ryton) Contacts (1-30 positions): Copper alloy, gold plate Guide pin (optional, one or both ends): 300 series stainless steel Wide selection of wire sizes, types, and color finish. Coupling feature: Friction Contact spacing: .050" (1.27) centres

MICRO-D CONNECTOR SAVER

  • A Connector Saver provides protection against excessive wear subjected to excessive mating and un-mating during any process or testing.
  • Space reduction (2 in 1 connectors)
  • Opposite mating genders
  • No termination required ready to us

HI-DENSITY CARD CONNECTOR

Designed for a space-conscious industry. Provides an extremely dense and reliable interconnection for card-to-card and card-to-cable applications. Connector performance per M83513 specifications. Available in vertical mount for thru-hole applications and wire harness termination styles for both plug and receptacle.Wide selection of wire sizes (24 thru 30). Shell employs a polarizing "D" shape for correct mating.

PERFORMANCE SPECIFICATIONS Micro-D
Contact Rating:   3 amps max.
Magnetic Permeability: ASTM-A342/A342M 2.0 µ max.
Dielectric Withstanding Voltage (DWV) :
Test voltage rms 60Hz ac volts
EIA-364-20 At sea level: 600 vac for solder pot and standard wire at 70,000 ft altitude (reduced barometric pressure): 150 vac for solder pot and standard wire
Insulation Resistance: EIA-364-21 5000 megohms min.
Contact Resistance: EIA-364-23 8 milliohms at 3 amps
Contact Engagement Force: MIL-DTL-83513 6.0 oz. max.
Contact Separation Force: MIL-DTL-83513 0.5 oz. min.
Connector Mating Force: MIL-DTL-83513 (10 oz. times no. of contacts) max.
Connector Unmating Force: MIL-DTL-83513 (0.5 oz. times no. of contacts) min.
Thermal Shock (Temperature Cycling): EIA-364-32, condition I, 5 cycles No physical damage -55°C to +125°C (-67°F to +257°F)
Mechanical Shock (Specified Pulse): EIA-364-27, condition E No physical damage and no loosening of parts, No loss of continuity > 1 microsec.
Vibration: EIA-364-28, condition IV No physical damage and no loosening of parts, No loss of continuity > 1 microsec.
Durability: MIL-DTL-83513 500 mating cycles at a rate of 200 ±100 CPH
Salt Spray (Corrosion): EIA-364-26, condition B Meets mateability and contact resistance requirements
Fluid Immersion: MIL-DTL-83513 Meets mateability requirements
Humidity: EIA-364-31 Meets D.W.V. and insulation resistance requirements 1 megohm nim. after step 6, 1000 megohms min. after 24 hrs. of conditioning
Insert Retention (class M): MIL-DTL-83513 50 lbs. min. (axial load)
Solderability: MIL-STD-202, method 208 Withstand test conditions
Contact Retention E: IA-364-29 5 lbs. min. (axial load)
Thermal Vacuum Outgassing (Space Classes): SP-R-0022 or ASTM E595 Exceeds MIL-DTL-83513 requirements; standard is 1.0% max TML and 0.1% max VCM or original mass

MATERIAL SPECIFICATIONS Micro-D
Shell Material: Std. Metal (100, 106, 110 & M13 Series) Aluminum alloy 6061-T6 per QQ-A-200/8
104 Series Stainless Steel
Std. Plastic (101, 102 & 105 Series) Polyphenylene sulfide (Ryton)
High Temp Plastic High-performance thermoplastic (PEEK or equivalent)
Shell Finish (Metal Shells only): Anodized, Cadmium, Gold, Irridite/Alodine Electroless Nickel, Tin
Insulator/PCB Backshell: Polyphenylene sulfide (Ryton) per MIL-M-24519, type GST-40F; color: Black
Contacts: Copper alloy, 50 micro-inches gold plate over nickel
Hardware: Stainless Steel, Passivated
Potting Material: Std. Epoxy EP1730-1 or equivalent; color: Black
High Temp Epoxy EP173859 or equivalent