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Time limits: Any time limits (example: year 2010) have
been removed from all Exemptions) |
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Note: |
Amendments of importance
to Electronic CONNECTOR Manufacturing and Use are highlighted. |
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ANNEX - Amendments 1-10 |
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1.
Mercury in compact fluorescent lamps not exceeding 5mg per lamp |
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2.
Mercury in straight fluorescent lamps for general purposes not
exceeding: |
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Halophosphate - 10mg,Triphosphate with
normal lifetime - 5mg, Triphosphate with long lifetime - 8mg |
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3.
Mercury in straight fluorescent lamps for special purposes |
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4.
Mercury in other lamps not specifically mentioned in this list |
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5.
Lead in the glass of cathode ray tubes, electronic components and fluorescent
tubes |
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6. Lead as an alloying
element in: |
1) steel containing
up to 0.35% lead by weight, |
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2) aluminium containing up to 0.4% lead by
weight |
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3) and as a copper
alloy containing up to 4.00% lead by weight. |
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e.g
Brass or Phosphor Bronze |
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7.
Lead in high melting temperature type solders (i.e. tin-lead solder alloys
containing more than 85% lead). |
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Lead
in solders for servers, storage and storage array systems, network
infrastructure equipment. |
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for
switching, signalling, transmission as well as network management for
telecommunications. |
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NOTE: |
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See FAQ 13 comments on
this exemption commonly referred to as RoHS 5. |
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Lead
in electronic ceramic parts (e.g. piezoelectronic devices). |
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Oct
21/2005 Revision |
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8. Cadmium and its
compounds in electrical contacts and cadmium plating
except for applications
banned |
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under Directive
91/338/EEC amending Directive 76/769/EEC relating to restrictions |
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on
the marketing and use of certain dangerous substances and preparations. |
Oct
21/2005 Revision |
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9.
Hexavalent chromium as an anti-corrosion of the carbon steel cooling system
in absorption refrigerators. |
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10. Within the procedure
referred to in Article 7(2), the Commission shall evaluate the applications
for the following |
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as a matter of priority in order to
establish as soon as possible whether these items are to be amended
accordingly: |
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Deca BDE, mercury in straight fluorescent
lamps for special purposes, lead in solders for servers, storage, storage
array |
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systems, network infrastructure equipment
for switching, signaling, transmission as well as network management |
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for telecommunications (with a view to
setting a specific time limit for this exemption), and light bulbs. |
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Amendment to Annex 15/Oct/2005 Exempting
DecaBDE from PBDE Value |
>>> |
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(2005/717/EC) |
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Amendment
21/Oct/2005 Application of Lead & Cadmium |
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>>> |
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(2005/747/EC) |
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11. Lead used in
COMPLIANT PIN CONNECTOR systems. (Press-fit Connectors) |
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12.
Lead as a coating material for the thermal conduction module
c-ring. |
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13. Lead and
cadmium in optical and filter glass. |
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14.
Lead in solders consisting of more than two elements for the connection
between the pins and the package of |
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microprocessors
with a lead content of more than 80% and less than 85% by weight. |
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15. Lead in solders to
complete a viable electrical connection between semiconductor die and carrier
within |
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integrated circuit Flip Chip packages. |
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Amendment 21/April/2006
Hexavalent Chromium in Category 3 Equipment |
>>> |
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(2006/310/EC) |
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16. Lead in linear incandescent lamps with
silicate coated tubes. |
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17. Lead halide as radiant agent in High
Intensity Discharge (HID) lamps used for reprography applications. |
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18. Lead as activator in fluroescent powder
of discharge lamps for specialty lamps. |
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19. Lead in amalgams used in very compact
Energy Saving Lamps (ESL). |
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20. Lead oxide in glass used in flat
fluorescent lamps used for LCDs. |
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Amendment 12/0ct/2006
Application of Lead & Cadmium |
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>>> |
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(2006/691/EC) |
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21. Lead and cadmium in printing inks for
the application of enamels on borosilicate glass. |
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22. Lead as impurity in rare earth iron
garnet (RIG) Faraday rotators used in fibre optic communication systems. |
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23. Lead in finished of fine pitch
components other than connectors with a pitch of 0.65mm or less. |
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24. Lead in solders used for through hole
discoidal and planar array ceramic multilayer capacitors. |
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25. Lead oxide in plasma display panels
(PDP) and surface conduction electron emitter displays (SED). |
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26. Lead oxide in the glass envelope of
Black Light Blue (BLB) lamps. |
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27. Lead alloys as solder for transducers
used in high-powered loudspeakers. |
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Amendment 12/0ct/2006
Hexavalent Chromium in Category 3 equipment. |
>>> |
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(2006/692/EC) |
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28. Hexavalent Chromium in corrosion
preventive coatings used in Category 3 Equipment. |
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Amendment 12/0ct/2006
Lead in Crystal Glass |
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>>> |
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(2006/690/EC) |
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29. Lead bound in crystal glass as defined
in Annex 1 of Council Directive 69/493/EEC. |
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